A walk through
the technology
AOI vision
Down to the micron
Every die is checked on all six sides in a single pass, front, back and sidewalls, using visible light, plus infrared to detect cracks beneath the surface. Grayscale or color processing adapts automatically to the material being sorted.
MB AI vision
Intelligence that improves the yield
MB AI Vision turns every inspected die into training data, sharpening defect classification the longer a line runs. MB IQ Studio manages these models under your control, while MB ADI, our Autonomous Diagnostic Intelligence, handles routine diagnostics on its own.
Smart Factory
Automation that runs itself
Self-calibrating systems remove the need for expert setup on the floor, cutting both cost and dependence on any one location. Full GEM300 compliance keeps everything integrated into automated fab environments built for lights-out operation.
Die Sorting Technologies
DS Merlin 60K
The world's benchmark in Die Sorting
Ultra-high-speed
AI-driven 6-side AOI inspection
HIGH-VOLUME PRODUCTION
Up to 1 million dies per day with high-throughput T&R processing and low cost per die.
MULTI-SPECTRUM VISION TECHNOLOGY
Visible, NIR and SWIR imaging for detailed inspection and accurate defect detection.
AI-BASED YIELD AND UPTIME OPTIMIZATION
60% reduction in yield loss, fewer false rejects and increased good-die output. Up to 20% higher daily output, reduced operator dependency and self-recovery.
EFFICIENT OPERATION
Automatic self-alignment reduces setup time, operator dependency and costs by around 25%.
DS Merlin Wafer-to-Wafer/Wafer-to-Panel
Precision for advanced packaging applications AND SILICON PHOTONICS
FLEXIBLE OUTPUT MEDIA: WAFER, PANEL OR TRAY
Sorting across different formats with high UPH. 12” Reconstructed Wafer/Panel or 600 mm Panel Bonding.
RECONSTRUCTED DIE SORTING: FAN-IN / FAN-OUT
Precise die placement with high placement accuracy.
DIRECT DIE BONDING ON PCB WITHOUT CARRIER TAPE
No carrier tape required, reducing consumables and running costs.
INLINE OR OFFLINE PROCESS CONTROL
Flexible integration into backend, SMD lines or magazines.
MB Albatross
Lights-out production with max uptime, yield and operational efficiency
HIGHER REAL OUTPUT
Dual handling reduces idle time and increases throughput per shift, especially for larger die sizes.
FAST LIGHTS-OUT CHANGEOVER
Fully automated changeover in less than 30 minutes without any operator involved.
ACCURATE COPLANARITY CONTROL
Warpage and TRUE Force Control improve placement accuracy and yield.
SCALABLE FACTORY AUTOMATION
GEM3000-ready for AGV and OHT automated factory integration. Output in tape & reel, tray-in/tray-out, and reconstructed wafer formats.
DS Variation Pro
FLEXIBLE, HIGH-PERFORMANCE DIE SORTING WITH ADVANCED INSPECTION CAPABILITIES.
SUPPORTS RECONSTRUCTED WAFERS, TRAYS, TAPE & REEL AND DE-TAPING
ULTRA-HIGH PRECISION PLACEMENT
Up to ±10 μm placement accuracy for advanced packaging applications.
INTEGRATED 1 μm INSPECTION
Built-in AOI-level inspection detects even the smallest defects in-line. Sidewall and IR inspection capabilities.
MAXIMUM APPLICATION FLEXIBILITY
For die sizes from 0.2–50 mm and beyond, all on a single platform.
HIGH-UPTIME LIGHTS-OUT OPERATION
Fully automated changeover in <30 min enables 24/7 production with minimal downtime.
DS Variation Eco-Line
Cost-optimized Die Sorting platform with maximized flexibility
LOWEST ENTRY COSTS
Minimized CAPEX risk, making it an ideal starting point for die sorting.
INTEGRATED QUALITY INSPECTION
Wafer, placement, and sidewall inspection, including tray scan capability.
RIGHT-SIZED PRECISION
±30 μm (±20 μm optional), so you only pay for the precision you need.
MULTI-FORMAT CAPABILITY
Supports wafer, waffle pack, T&R and de-taping in one system.
