Inlay Assembly Technologies
DDA WF FAMILY
Flexible chip attach platform for every production volume
UPGRADEABLE BY DESIGN
Grows with your production needs without requiring a system replacement as demand increases.
MAXIMUM FLEXIBILITY
One platform for a wide range of antenna formats and production volumes, ideal for diverse product portfolios.
HIGH-YIELD MANUFACTURING
Integrated quality control for reliable output in high-volume production environments.
COMPACT HIGH-SPEED SOLUTION
High throughput in a compact footprint for facilities with limited floor space.
DDA 40K
High-speed chip attach for cost-efficient RFID inlay production
PROVEN PRODUCTION TECHNOLOGY
Trusted by RFID manufacturers worldwide with more than 80 installed systems and over 10 billion products produced.
REDUCED PRODUCTION COSTS
Patented Direct Die Attach technology reduces chip attach costs by up to 80% compared to conventional approaches.
MAXIMUM OUTPUT PER FOOTPRINT
Up to 40,000 UPH with a single bonding station, while requiring less production space and a 30% smaller footprint.
RELIABLE HIGH-VOLUME MANUFACTURING
High throughput, stable uptime and high process accuracy for demanding production environments.
DDA 40K – P
Sustainable chip attach solution for paper-based RFID production
FUTURE-PROOF MATERIAL FLEXIBILITY
Processes both transparent and non-transparent materials, including paper and PET substrates.
SUSTAINABILITY MEETS HIGH SPEED
Combines sustainable production concepts with the proven productivity of Direct Die Attach technology.
RELIABLE HIGH-QUALITY OUTPUT
Integrated testing and process control ensure stable production and consistent product quality.
FLEXIBLE PRODUCTION PLATFORM
Supports changing material requirements and enables the transition to more sustainable RFID products.
