Smart Card Production
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SMART CARD PRODUCTION TECHNOLOGY
Chip Module Testing & Pre-Personalization
Incoming chip modules are tested for electrical functionality and mechanical dimensions. Customized electrical tests can be performed according to different test patterns for contact and contactless chips. Identified reject modules are marked by reject punching, enabling the pre-personalization of a determined quantity of IC Modules.
Glue tape lamination is the preparation of the module tapes for the hot melt process. IC Modules are laminated on the back side with an adhesive tape. For dual interface card production, a small modification is necessary to free the additional two positions which are later used for the Flexible Bump connection.
During this process step cavities for IC Modules are milled into the card bodies. The cavities are dimensioned according to the size of the module to be implanted. To free the antenna inside the card body, the antenna touch system which detects any kind of antenna stops on the antenna surface with highest accuracy.
Dual Interface Card Production
The Dual Interface Card Production is based on proven Mühlbauer technology, such as the Flexible Bump technology which assures the secure contact between module and antenna. A special conductive glue is dosed with highest accuracy between the antenna and the module which, after hardening for a certain time, is acting as a flexible connection between the two parts. The new MB TeConnect technology is based on this longtime experience, combining the antenna-touch-milling technology with a new connection medium.
IC Modules are punched out of the tape before being placed and fixed in the cavity of the card. During the process the hot melt tape provides the adhesion of the module in the cavity while the Flexible Bump, which is now under tension (spring function), guarantees a durable connection.
This process step combines two essentials of smart card production in one system. Cavities, which are dimensioned according to the size of the module to be implanted, are milled into the card bodies. The IC modules are punched out of the tape before being placed and fixed in the cavity. During the process the hot melt tape provides the adhesion of the module in the cavity while the Flexible Bump guarantees a durable connection.
During this process step cards are fed to the punching and stamping station where GSM shapes are punched out of the card. After the punching, only narrow “bridges” of plastic connections remain between the main card body and the GSM card which can be easily broken out by the end customer. The processed cards can be stacked back into standard magazines to continue with other production steps.
In order to achieve highest quality in the results, every process step of the production chain is continuously checked and controlled by quality assuring procedures. The testing depth and numbers of control samples are adjustable to the respective needs of the processes and the product specifications. Specific procedures, measurements and statistic process knowledge guarantee optimal results ensuring highest yields.
