Dual Interface Card Production
The Dual Interface Card Production is based on proven Mühlbauer technology, such as the Flexible Bump technology which assures the secure contact between module and antenna. A special conductive glue is dosed with highest accuracy between the antenna and the module which, after hardening for a certain time, is acting as a flexible connection between the two parts. The new MB TeConnect technology is based on this longtime experience, combining the antenna-touch-milling technology with a new connection medium.
Mühlbauer's Dual Interface Card Production Systems
MFB 2500
- Fully automatic preparation of dual interface card bodies with the patented MB Flexible Bump technology
- Automatic milling of antenna connection pads with the patented MB Antenna Touch System (ATS)
- Graphical based dosing design programming
- Automatic in-line quality control ensuring highest yield & quality
- INCAPE ready
- Up to 2,500 UPH
CMFB 2500
- Fully automatic preparation of dual interface card bodies with the patented MB Flexible Bump technology
- Automatic milling of module cavity & antenna connection pads with the patented MB Antenna Touch System (ATS)
- Graphical based milling & dosing design programming
- Automatic in-line quality control ensuring highest yield & quality
- INCAPE ready
- Up to 2,500 UPH
DICL 5000
- Compact system for in-line production of dual interface cards
- MB TeConnect® technology, developed for longest life time & easy handling
- Equipment also suitable for milling & implanting of standard contact cards
- Operator-friendly, flexible & modular system design
- 5,000 UPH (standard Smart Cards); 2,200 UPH (dual interface cards with TeConnect®)
MB TeConnect®
- Lowest investment with no quality compromise
- Freedom to choose chip and inlay supplier
- True contact between chip module and antenna
