Chip Module Punching

During this process step cards are fed to the punching and stamping station where GSM shapes are punched out of the card. After the punching, only narrow “bridges” of plastic connections remain between the main card body and the GSM card which can be easily broken out by the end customer. The processed cards can be stacked back into standard magazines to continue with other production steps.

Mühlbauer's Chip Module Punching Systems

CMP 2000/M

  • Semi-automatic system for punching & pre-cutting
  • 1 punching / cutting unit
  • Manual card handling
  • Operator-friendly
  • In-house tool manufacturing and customizing
  • Quick tool change
  • Customized punching die
  • Up to 2,000 UPH
Learn more about CMP 2000/M

CMP 2020

  • Fully automatic system for punching & pre-cutting
  • New MB replug tool generation for punching of multiple DUAL-SIM or all SIM sizes of one card in one step
  • Up to 3 independent punching / cutting units
  • Single- & DUAL-SIM handling
  • Operator-friendly, flexible & modular system design
  • In-house tool manufacturing & customizing
  • INCAPE ready
  • Up to 5,000 UPH (SINGLE-SIM); up to 7,000 UPH (DUAL-SIM)
Learn more about CMP 2020