Smart Card Implanting
IC Modules are punched out of the tape before being placed and fixed in the cavity of the card. During the process the hot melt tape provides the adhesion of the module in the cavity while the Flexible Bump, which is now under tension (spring function), guarantees a durable connection.
Mühlbauer's Smart Card Implanting Systems
SCI 202
- Fully automatic implanting of IC Modules into plastic cards
- Suitable for contact & dual interface card production
- Operator-friendly, flexible & modular system design
- Scratch-free handling of card bodies due to vacuum card separation
- Operator-friendly & fast tool changing
- In-house tool manufacturing & customizing
- INCAPE ready
- Up to 3,500 UPH
SCI 5001
- Fully automatic implanting of IC Modules into plastic cards
- Suitable for contact & dual interface card production
- Operator-friendly, flexible & modular system design
- Up to 4 hot press stations for maximum speed
- Scratch-free handling of card bodies due to vacuum card separation
- Operator-friendly & fast tool changing
- In-house tool manufacturing & customizing
- INCAPE ready
- Up to 5,000 UPH
