The quality standards of the semiconductor industry require a very high precision and 100% inspection check in a fast running process. Especially the backend processes of the Wafer level Chip scale Packages (WLCSP) are subject to the zero defect policy. Mühlbauer offers a wide range of vision inspection features to deliver highest quality output, not only for 2 sides (front/top and back side) but for all 6 Sides of a die / product.
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Wafer Inspection
Side-wall Inspection
Die-on-fly Inspection
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Pre-place Inspection
Post-place Inspection
After-sealing Inspection