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Die Sorting


undefined Die Sorting


Mühlbauer's Die Sorting systems are world leading in terms of quality, precision, speed and flexibility. The roots in the semiconductor backend area go back to 1986 where Mühlbauer started to develop die bonding technology and where the first vision inspection tools were established.

Today, Mühlbauer offers the complete turnkey solution for both, Die Sorting and Carrier Tape. Our customers profit from the perfectly matching components as well as the highly flexible carrier tape supply process.

Click here for more information on Mühlbauer's Carrier Tape Solution

Die Sorting Systems pick dies from a wafer and place them onto different carriers like carrier tape, waffle pack, jedec tray or film frame.

Mühlbauer can handle dies as small as 0.2 x 0.4 mm and down to 80 mµ tickness with the highest level of precision and speed. A record speed of up to 30.000 UPH is reached thereby including a 100 % vision inspection incl. SideWall Inspection. All of our vision technologies are developed in house to achieve high performance equipment solutions.




 Discover our huge portfolio:


High Speed FLIP CHIP Tape & Reel Systems

With up to 30,000 UPH and no compromise on quality, the DS Merlin and DS 20000  systems assure the best COO values to our customers.

Automatic Reel Changer is an optional complementary module for Die Sorting Machines. Enables automated productivity with low reel-change-time.

Discover a new, particularly gentle die handling method at the so called DS Laser.



Maximum flexibility with the VARIATION Series

The VARIATION series was built to combine a wide range of different sorting configurations:

  • Tape and Reel
  • Waffle Pack / Gel Pack
  • Jedec Tray
  • Reconstructed Wafer up to 12 inch
  • Wafer to Wafer