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Die Sorting

World leading in terms of quality, precision, speed and flexibility


Our roots in the semiconductor backend area go back to 1986 where Mühlbauer started to develop die bonding technology and where the first vision inspection tools were established.

Today, Mühlbauer offers the complete turnkey solution for both, Die Sorting and Carrier Tape. Our customers profit from the perfectly matching components as well as the highly flexible carrier tape supply process.

Click here for more information on Mühlbauer's Carrier Tape Solution

Die Sorting Systems pick dies from a wafer and place them onto different carriers like carrier tape, waffle pack, jedec tray or film frame.

Mühlbauer can handle dies as small as 0.2 x 0.4 mm and down to 80 mµ tickness with the highest level of precision and speed. A record speed of up to 30.000 UPH is reached thereby including a 100 % vision inspection incl. SideWall Inspection. All of our vision technologies are developed in house to achieve high performance equipment solutions.

 

DISCOVER OUR GREAT PORTFOLIO:

 

High Speed Systems

With up to 45,000 UPH and no compromise on quality, the DS Merlin systems assure the best COO values combined with 100% Optical inspection to our customers.

Automatic Reel Changer is an optional complementary module for Die Sorting Machines. Enables automated productivity with low reel-change-time.

  

Highly Flexible Systems

With up to 6,000 UPH and maximum functionality, the DS VARIATION ecoLINE is a cost efficient handling system a wide range of different sorting configurations:

  • Tape and Reel
  • Waffle Pack / Gel Pack
  • Jedec Tray
  • Reconstructed Wafer up to 12 inch
  • Wafer to Wafer

combined with highly accurate 6 Side inspection capability.

Discover a new, particularly gentle die handling method at the so called DS Laser.

 

Sensor & Electrical Test System

Electrical and Sensor Devices are tested, marked and Sorted with our  eSIM PERSO technology combined with quality control capability and 100% traceability. 


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