DS Variation ecoLINE

Mühlbauer’s overall goal is to significantly reduce the initial investment costs with the DS VARIATION ecoLINE, while at the same time guaranteeing maximum functionality in one platform. The DS VARIATION ecoLINE stands out for its cost-effective design and its precise AOI vision inspection capability. The chip placement has an integrated high-accuracy mode that can achieve a value of 20 µm. All standard inspection features, especially the top, backside and sidewall inspection, guarantee a 100% six-side chip control. Our latest IR inspection for backside and sidewall detection further enhances output quality. The DS VARIATION ecoLINE has the ability to handle a variety of niche applicants, including T&R, De-Taping, Tray & Waffle packs and reconstructed wafers up to 12”.