Producción de módulos IC
Mühlbauer is the only one-stop shop technology partner who can offer the complete manufacturing line for the production of IC modules. We offer high quality and high precision state-of-the-art equipment - ranging from die bonding, where the die is placed onto the backside of the module tape, to wire bonding, encapsulation, inspection and electric testing of the finished module tapes. As our machine concept is market proven and we continuously develop our hard- and software, we evolved to one of the most competent suppliers of IC module production equipment.Using our vast experience we offer apposite consulting solutions for your business from the planning stage to sales and post sales support. We can bring you together with all primary global players on the IC module market. Our flexible financing concepts provide an additional incentive for choosing Mühlbauer solutions.
Die Bonding
The chip is placed onto an IC module tape (lead frame). Typically, epoxy glues are used to fix the chip on the rear side of the tape. The exact pick-up and place position of the chip from the wafer is controlled by several vision systems. After chip attachment the resin is cured by an inline thermal curing oven before the tape is finally rolled up.
Wire Bonding
The contact pads of the chip are electrically connected to the contact pads of the tape by an approximately 30μm thick gold wire. The wires are fixed to the contact pads using the thermosonic bonding method.
Encapsulation
Casting resin is applied to protect the bare die and exposed wires against mechanical and environmental influences. Typically, a transparent UV-curing material or a black thermal-curing material is used for potting. Due to the high accuracy of this method, no further processing of the surface such as milling is necessary. For the dispensing process itself, two different methods can be used: Dam&Fill or Glob-Top. In Dam&Fill mode, the first dispensing head sets a dam to restrict the area for the glob-top. Then the second dispensing head fills the area inside the dam. In Glob-Top mode, both dispensing heads completely fill the entire module.
Tape Inspection
The fully automatic optical inspection carries out a thickness measurement and checks the glob tops and the surfaces. The front and/or rear side of the tape is controlled for surface defects like open wedges or scratches, fingerprints, etc. It is even possible to integrate an electrical test station to produce finished and dispatchable modules. Faulty modules are clearly marked by a reject punch hole.
Molding
This process step is typically used for 3-row tapes for contactless cards, ID applications and ePassports. The multi plunger mold system works with an electro-mechanical press. The process includes off-line cleaning which increases the productive uptime.
Electrical Test & Pre-Personalization
As an output functional test, the IC modules are electrically singulated and tested or even pre-personalized in one process step. Depending on the chip type (memory or microprocessor chip) complex test routines and parameter tests are performed by best-in-class test readers. Faulty modules are clearly marked by a punch hole.
IC Module Brochure
