Chip Module Encapsulation

In the encapsulation process of IC module production, the resin is applied to protect the chip and wires against mechanical and environmental stress. Typically, the black thermal curing material or the transparent UV curing material is used for encapsulation. Due to the high accuracy of this method, no additional surface treatment such as milling is required. Two different methods can be used for the dispensing process itself: Dam&Fill or Glob Top. In Dam&Fill mode, the first dispensing head places a dam to border the Glob Top area. Then a second dispensing head fills the area inside the dam. In Glob Top mode, both dispensing heads completely fill the entire module.