Flexible LED

The Mühlbauer Group can look back to more than 30 years of experience in the semiconductor industry: During the past decades, we achieved record-breaking results in the handling of smallest devices as well as in micro-chip die sorting.

After the launch of its flexible LED production line TAL 15000_LED back in 2015, Mühlbauer further developed the Multi component and luminaire assembly process towards a universal system: the MCL - Multicomponent Line.

Besides the standard jetting of adhesives such as ACP, now the dispensing of ICPs and/or solder paste is possible, even screen printing is one of our latest developed inline technologies to open higher flexibility.

Furthermore, the component attachment has been simplified and enlarged to achieve a high speed up to 10.000UPH or even 25.000 UPH. Now, a high variety of components can be attached: SMD or Flip Chip dies, CSP or SMD LEDs, sensors, connectors, capacitors or even RFID Flip Chips and other electrical components for final assembly of flexible intelligent electronics, meeting the future trend of IOT.

The curing technology of our Flip Chip Thermodes curing elements have been extended with the possibility to use inline drying oven as well to use both technologies in one shot. The final test station will perform a 100% quality check through component / position inspection of light up check for luminaires to guarantee highest possible output yield.

 APPLICATIONS FOR FLEXIBLE LUMINAIRES AND FLEXIBLE ELECTRONICS (FLEX PCB)

•         LUMINAIRE ASSEMBLY
•         Solder or adhesive connection (ACP, ICP or reflow)
•         CSP/Flip chip LED or SMD packages
•         Electrical components, current or color controller
•         Connector, lenses or other components
•         Wide web up to 350mm
•         Narrow web up to 100mm
•         Glob top unit for encapsulation
•         Test Unit
•         Get flexible instead of rigid to discover new market applications
•         Make use of a super low cost material such as aluminum PET
•         and save more than 30% manufacturing costs
•         Other high end materials available such as copper or Pl / Kapton can run as well in case of                higher performance
•         Latest curing technology for interconnection such as ACP or solder materials