The CME 3060 represents a new generation of high speed chip module encapsulation equipment. While concentrating on 100% INLINE PROCESS CONTROL the machine also features 50% more curing capacity compared to other systems.
Based on the new dosing head design program with 16-fold encapsulation and improvements in terms of quality and maintenance friendliness, an easy and quick recipe creation is now possible. CME 3060 can work with thermal-, UV and even an LED UV curing station. The LED UV curing system requires significantly less space while having more power (compared to standard UV discharge lamps) thus enabling high speed production. In order to guarantee best output quality control, the Tape Inspection process of TI 2280 can be integrated inline. The TI 2280 controls the thickness or optically inspects the front and back side. It is even possible to integrate an electrical test station to get completely finished modules ready for shipment.
NEW on CME 3060