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Smart Card Implanting

IC Modules are punched out of the tape before being placed and fixed in the cavity of the card. During the process the hot melt tape provides the adhesion of the module in the cavity while the Flexible Bump, which is now under tension (spring function), guarantees a durable connection.

Mühlbauer's Smart Card Implanting Systems

SCI 201

  • Fully automatic implanting of IC Modules into plastic cards
  • Suitable for contact and dual interface card production
  • Operator friendly, flexible and modular system design
  • Scratch-free handling of card bodies due to vacuum card separation
Erfahren Sie mehr über SCI 201

SCI 5001

  • Fully automatic implanting of IC Modules into plastic cards
  • Suitable for contact and dual interface card production
  • Operator friendly, flexible and modular system design
  • Up to 4 hot press stations for maximum speed possible
Erfahren Sie mehr über SCI 5001