DS VARIATION highLINE is an innovation that leads you to new applications in the Semiconductor world - a platform solution providing highest quality control on the chips to be handled as well as possibilities for placing them onto the package as needed. This ultra flexible system picks up chips from the wafer where the flip or non-flip mode can be chosen by simply pushing a software button. The chips are placed into the carrier, e.g. Waffle Pack/Gel Pack, Jedec tray, film frame, glass tool, lead frame, carrier tape or other defined carriers. A 100 % quality control on each process step is included and a 6-side inspection with ultra high resolution can be integrated optionally. The DS VARIATION offers the perfect solution for your needs with both, benefits in high volume multi bin sorting as well as the capability to cover a whole range of niche applications.
Just select your suitable output configuration!