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Mühlbauer Die Sorting

Setting the benchmark in WLCSP flip chip die sorting.


 

Mühlbauer's Die Sorting systems are world leading in terms of quality, precision, speed and flexibility. The roots in the semiconductor backend area go back to 1986 where Mühlbauer started to develop die bonding technology and where the first vision inspection tools were established.

Today, Mühlbauer offers the complete turnkey solution for both, Die Sorting and Carrier Tape. Our customers profit from the perfectly matching components as well as the highly flexible carrier tape supply process.

Click here for more information on Mühlbauer's Carrier Tape Solution

 

 

Discover our huge portfolio:

 

Tape and reel systems

With up to 15,000 respectively 20,000 UPH and no compromise on quality, the DS 15000 and DS 20000 systems assure the best COO values to our customers.

Explore our brand new functionalities like the O/S Test, integrated in the DS Falcon model or discover a new, particularly gentle die handling method at the so called DS Laser.

 

Maximum flexibility with the VARIATION Series

The VARIATION series was built to combine a wide range of different sorting configurations:

  • Tape and Reel
  • Waffle Pack
  • Jedec Tray
  • Reconstructed Wafer
  • Wafer to Wafer