CML 3420 & CML 3430
Glue tape lamination system
The glue tape lamintation systems CML 3420 and CML 3430 prepare IC modules for the hot implanting process with the reel-to-reel principle.
Fastest setup time for different products
Highest reliability
Highest throughput of up to 18,000 modules per hour
Lowest cost of ownership
Highest autonomic production time
Sensor and mechanically controlled module tape transport
Best processability by top and bottom plate heating
Tool change within seconds without removal of module tape
Minimum floor space
Your applications
Lamination of IC module tapes(highest uptime and processability for high autonomy module tape lamination)
