Die Bonding
Die bonding is the assembly of the chip onto the IC module tape. Mostly epoxy glues are used to fix the chip on the rear side of the tape. The exact pick-up positioning of the chip the wafer is controlled by vision systems (PRS).
Wire Bonding
The contact pads of the chip are electrically connected to the contact pads of the tape by approximately 25 µm gold wires. The wires are fixed on the contact pads by a thermosonic bonding process.
Chip module encapsulation
Resin is dispensed to protect the chip and wires against mechanical and environmental stress. Mostly thermal curing (= black epoxy)/or UV curing materials (transparent materials)/or thermal materials are used. The resin is finally cured in an inline oven system before the tape is reeled on.
Dam & Fill is a method to encapsulate large chips. A first dispensing head is placing a dam bar to limit the glob top area. A second head fills up with material inside the dam.
Tape inspection
Optical test is the full dimension control of transparent glob tops as well as black globe tops with visual bleed out. The backside of the tape is controlled for surface defects like scratches, fingerprints, etc. Faulty modules are clearly marked by a punch hole.
Molding
Reel-to-reel stand-alone, fully automatic, multi plunger mold system with electromechanical press, for leadframe tape.
Chip module encoding and testing
As an output functional test the IC modules are electrically tested. Therefore the modules on the tapes are electrically seperated. Depending on the chip type - memory or microprocessor chip - more or less complex test routines and parameter tests are performed. Faulty modules are clearly marked by a punch hole.
Flip chip bonding & tape inspection
Flip chip bonding is the future oriented assembly of the die onto the IC module tape. The die is flipped by 180° and directly placed onto the contact pads of the module. The parts of wire bonding and encapsulation are not necessary any more.
